1. 2. 3. material content data sheet sales product name idw30g65c5 issued 29. august 2013 ma# MA001003350 package pg-to247-3-41 weight* 6045.51 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material siliconcarbide 409-21-2 1.933 0.03 0.03 320 320 leadframe non noble metal iron 7439-89-6 0.530 0.01 88 inorganic material phosphorus 7723-14-0 0.159 0.00 26 non noble metal copper 7440-50-8 529.068 8.75 8.76 87514 87628 wire non noble metal aluminium 7429-90-5 3.058 0.05 0.05 506 506 encapsulation organic material carbon black 1333-86-4 20.063 0.33 3319 plastics epoxy resin - 381.204 6.31 63056 inorganic material silicondioxide 60676-86-0 1605.071 26.55 33.19 265498 331873 leadfinish non noble metal tin 7440-31-5 31.874 0.53 0.53 5272 5272 plating non noble metal nickel 7440-02-0 29.065 0.48 0.48 4808 4808 solder non noble metal antimony 7440-36-0 0.100 0.00 17 noble metal silver 7440-22-4 0.250 0.00 41 non noble metal tin 7440-31-5 0.650 0.01 0.01 108 166 heatspreader inorganic material phosphorus 7723-14-0 1.033 0.02 171 non noble metal iron 7439-89-6 3.442 0.06 569 non noble metal copper 7440-50-8 3438.006 56.87 56.95 568687 569427 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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